Intel Corporation has an opening for a Packaging Engineer – Materials in Chandler, Arizona. Duties: Emphasis in working with the material suppliers and materials technology group to establish a package materials property requirement, establish materials specs, capture IPs, and deploy/develop advanced package analytical laboratory tools and techniques and technical application with training notes to world-wide packaging community. Design and develop product packaging and provide ongoing engineering support for integrated circuit or semiconductor assemblies. Define overall package performance and specification. Ensure technology certification through layout design and test vehicle design. Conduct tests, research, and evaluate specifications on basic materials and properties. Establish material specifications for contract assemblers and raw material vendors and interface with Quality Assurance and Purchasing groups regarding materials. Provide consultation concerning packaging problems and improvements in the packaging process. Job duties may involve increased levels of responsibility over time. Salary: $ 85,966.00 - $ 148,200.00. Schedule: Monday – Friday, 8 AM – 5 PM. Standard Corporate Benefits. Minimum Requirements: Masters degree in Mechanical, Material, Electrical or Computer Engineering, or Science, or related Science, or Engineering Discipline. The following skills are required for the role: Mechanical behavior of materials; Statistical Tools; Material Characterization; Circuit Design; Polymer Chemistry; and Thermodynamics. Submit Resumes to: Recruitment and Employment Office, INTEL CORPORATION, Attn: Job Ref #: INT79069, P.O. Box 56625, Atlanta, GA 30343.
Primary Skills: MS Salary: Between - Experience Required: 0, years minimum Clearance Level: 0 Travel: %
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