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Electronics Packaging Engineer - Novi, Michigan

The PRA Group Inc.


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Electronics Packaging Engineer (HEV) - MI
 
Summary
Our client is a market leader in developing next generation vehicle technologies for powertrain, hybrid, stability controls, and other related systems. They’re currently looking for a HEV Design Engineer to support them in the field of electronic controller packaging. The HEV Design Engineer will be responsible for designing the package for electronic devices such as engine or transmission controllers and Hybrid Power Inverters etc.This is a great opportunity for an engineer looking for challenging technical work with a company that will invest in their future.  They offer a great long-term opportunity in a true team environment.

This position requires the candidate to travel 3 - 4 trips to Japan / Mexico and some to KY.
 
Job Responsibilities
Working with the customers to ensure the deliveries for the products designed at satellite offices
Design and implement the enclosures for packaging the electronic devices.

Qualifications
Bachelors degree in Mechanical Engineering
2+ years of experience in design engineering in automotive environment, including work in electronics packaging design.
Experience developing HEV systems is a strong plus.
Knowledge of 3D CAD (Solidworks ) and FEA
Aware of standard automotive procedures such as (DFMEA, PPAP, Design Reviews, etc)
Skilled in DFM, VA/VE and manufacturing techniques.


Location:  Detroit Area
Type:  Direct Hire
Travel: Domestic and International
Salary Range:  $70,000-85,000/year
Relocation Assistance:  Subject to review
Visa Sponsorship:  Subject to review
Primary Skills: Electronics Packaging, HEV, Automotive
Salary: Between 70000 - 85000
Experience Required: Experienced, 2 years minimum
Clearance Level: none
Travel: 0 %

Other Details:


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